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EL5129, EL5329
Data Sheet May 13, 2005 FN7430.1
Multi-Channel Buffers
The EL5129 and EL5329 integrate multiple gamma buffers and a single VCOM buffer for use in large panel LCD displays of 10" and greater. The EL5129 integrates 6 gamma channels and the EL5329 integrates 10 gamma channels. Half of the gamma channels in each device are designed to swing to the upper supply rail, with the other half designed to swing to the lower rail. The output capability of each channel is 10mA continuous, with 120mA peak. The gamma buffers feature a 10MHz 3dB bandwidth specification and a 9V/s slew rate. The VCOM amplifier is designed to swing from rail to rail. The output current capability of the VCOM in the EL5129 and EL5329 is 30mA continuous, 150mA peak and a slew rate of 10V/s.
Features
* Multiple gamma buffers - 6 channels (EL5129) - 10 channels (EL5329) * Single VCOM amplifier * Low supply current - 3.5mA (EL5129) - 5.5mA (EL5329) * For higher speed or higher output power, see the EL5x24 family * Pb-free available (RoHS compliant)
Applications
* TFT-LCD monitors * LCD televisions
Ordering Information
PART NUMBER EL5129IRE EL5129IRE-T7 EL5129IRE-T13 EL5129IREZ (See Note) EL5129IREZ-T7 (See Note) EL5129IREZ-T13 (See Note) EL5129IRZ (See Note) EL5129IRZ-T7 (See Note) EL5129IRZ-T13 (See Note) EL5329IREZ (See Note) EL5329IREZ-T7 (See Note) EL5329IREZ-T13 (See Note) EL5329IRZ (See Note) EL5329IRZ-T7 (See Note) EL5329IRZ-T13 (See Note) PACKAGE 20-Pin HTSSOP 20-Pin HTSSOP 20-Pin HTSSOP 20-Pin HTSSOP (Pb-free) 20-Pin HTSSOP (Pb-free) 20-Pin HTSSOP (Pb-free) 20-Pin TSSOP (Pb-free) 20-Pin TSSOP (Pb-free) 20-Pin TSSOP (Pb-free) 28-Pin HTSSOP (Pb-free) 28-Pin HTSSOP (Pb-free) 28-Pin HTSSOP (Pb-free) 28-Pin TSSOP (Pb-free) 28-Pin TSSOP (Pb-free) 28-Pin TSSOP (Pb-free) TAPE & REEL 7" 13" 7" 13" 7" 13" 7" 13" 7" 13" PKG DWG. # MDP0048 MDP0048 MDP0048 MDP0048 MDP0048 MDP0048 MDP0044 MDP0044 MDP0044 MDP0048 MDP0048 MDP0048 MDP0044 MDP0044 MDP0044
* Industrial flat panel displays
NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-352-6832 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
EL5129, EL5329 Pinouts
EL5129 (20-PIN TSSOP, HTSSOP) TOP VIEW
VS+ 1 OUT1 2 OUT2 3 OUT3 4 OUT4 5 OUT5 6 OUT5 7 NC 8 OUTCOM 9 VS- 10 THERMAL PAD* 20 VS+ 19 IN1 18 IN2 17 IN3 16 IN4 15 IN5 14 IN6 13 NC 12 INCOM 11 VS-
EL5329 (28-PIN TSSOP, HTSSOP) TOP VIEW
VS+ 1 NC 2 OUT1 3 OUT2 4 OUT3 5 OUT4 6 OUT5 7 OUT6 8 OUT7 9 OUT8 10 OUT9 11 THERMAL PAD* 28 VS+ 27 NC 26 IN1 25 IN2 24 IN3 23 IN4 22 IN5 21 IN6 20 IN7 19 IN8 18 IN9 17 IN10 16 INCOM 15 VS-
* THERMAL PAD CONNECTED TO PIN 10 OR 11 (VS-)
OUT10 12 OUTCOM 13 VS- 14
* THERMAL PAD CONNECTED TO PIN 14 OR 15 (VS-)
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FN7430.1 May 13, 2005
EL5129, EL5329
Absolute Maximum Ratings (TA = 25C)
Supply Voltage between VS+ and VS- . . . . . . . . . . . . . . . . . . . .+18V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . VS- -0.5V, VS+ +0.5V Maximum Continuous Output Current (VOUT0-9) . . . . . . . . . . 15mA Maximum Continuous Output Current (VOUTA). . . . . . . . . . . 100mA Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +125C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65C to +150C Ambient Operating Temperature . . . . . . . . . . . . . . . .-40C to +85C
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER
VS+ = +15V, VS- = 0, RL = 10k, CL = 10pF to 0V, TA = 25C unless otherwise specified DESCRIPTION CONDITIONS MIN TYP MAX UNIT
INPUT CHARACTERISTICS (REFERENCE BUFFERS) VOS TCVOS IB RIN CIN AV CMIR Input Offset Voltage Average Offset Voltage Drift Input Bias Current Input Impedance Input Capacitance Voltage Gain Input Voltage Range 1V VOUT 14V EL5129, IN1 to IN3 EL5329, IN1 to IN5 EL5129, IN4 to IN6 EL5329, IN6 to IN10 INPUT CHARACTERISTICS (VCOM BUFFER) VOS TCVOS IB RIN CIN VREG CMIRCOM Input Offset Voltage Average Offset Voltage Drift Input Bias Current Input Impedance Input Capacitance Load Regulation Input Voltage Range VCOM VCOM = 7.5V, -60mA < IL < 60mA -20 0 VCM = 7.5V (Note 1) VCM = 7.5V 1 3 2 10 1.35 +20 VS+ 50 20 mV V/C nA M pF mV V 0.992 1.5 1.5 0 0 VCM = 0V (Note 1) VCM = 0V 2 5 2 10 1.35 1.008 VS+ VS+ VS+ -1.5 VS+ -1.5 50 20 mV V/C nA M pF V/V V V V V
OUTPUT CHARACTERISTICS (REFERENCE BUFFERS) VOH High Output Voltage - EL5129 & EL5329 (Output 1) High Output Voltage - EL5129 (Output 2, 3), EL5329 (Output 2-5) High Output Voltage - EL5129 (Output 4-6), EL5329 (Output 6-10) VOL Low Output Voltage - EL5129 (Output 1-3), EL5329 (Output 1-5) Low Output Voltage - EL5129 (Output 4-5), EL5329 (Output 6-9) Low Output Voltage - EL5129 (Output 6), EL5329 (Output 10) ISC Short Circuit Current 100 VIN = 13.5V, IO = 5mA VIN = 1.5V, IO = 5mA VIN = 0V, IO = 5mA VIN = 15V, IO = 5mA 14.85 14.8 13.45 14.9 14.85 13.5 1.5 150 100 120 1.55 200 150 V V V V mV mV mA
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FN7430.1 May 13, 2005
EL5129, EL5329
Electrical Specifications
PARAMETER VS+ = +15V, VS- = 0, RL = 10k, CL = 10pF to 0V, TA = 25C unless otherwise specified (Continued) DESCRIPTION CONDITIONS MIN TYP MAX UNIT
OUTPUT CHARACTERISTICS (VCOM BUFFER) VOH VOL ISC High Level Saturated Output Voltage Low Level Saturated Output Voltage Short Circuit Current VS+ = 15V, IO = -5mA, VI = 15V VS+ = 15V, IO = -5mA, VI = 0V 150 14.85 14.9 0.1 170 0.15 V V mA
POWER SUPPLY PERFORMANCE PSRR Power Supply Rejection Ratio Reference buffer VS from 5V to 15V VCOM buffer, VS from 5V to 15V IS Total Supply Current EL5129 EL5329 DYNAMIC PERFORMANCE (BUFFER AMPLIFIERS) SR tS BW CS Slew Rate (Note 2) Settling to +0.1% (AV = +1) -3dB Bandwidth Channel Separation (AV = +1), VO = 2V step RL = 10k, CL = 10pF f = 5MHz 5 9 500 10 75 V/s ns MHz dB 50 55 80 80 3.5 5.5 4.5 7 dB dB mA mA
EL5129 & EL5329 DYNAMIC PERFORMANCE (VCOM AMPLIFIERS) SR tS BW CS NOTES: 1. Measured over operating temperature range 2. Slew rate is measured on rising and falling edges Slew Rate (Note 2) Settling to +0.1% (AV = +1) -3dB Bandwidth Channel Separation -4V VOUT 4V, 20% to 80% (AV = +1), VO = 2V step RL = 10k, CL = 10pF f = 5MHz 7 10 350 15 75 V/s ns MHz dB
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FN7430.1 May 13, 2005
EL5129, EL5329
Pin Descriptions
EL5129 1, 20 2 3 4 5 6 7 8, 13 9 10, 11 12 14 15 16 17 18 19 EL5329 1, 28 3 4 5 6 7 8 2, 27 13 14, 15 16 21 22 23 24 25 26 9 10 11 12 17 18 19 20 PIN NAME VS+ OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 NC OUTCOM VSINCOM IN6 IN5 IN4 IN3 IN2 IN1 OUT7 OUT8 OUT9 OUT10 IN10 IN9 IN8 IN7 Positive supply voltage Output gamma channel 1 Output gamma channel 2 Output gamma channel 3 Output gamma channel 4 Output gamma channel 5 Output gamma channel 6 No connect Output, VCOM Negative supply Input, VCOM Input gamma channel 6 Input gamma channel 5 Input gamma channel 4 Input gamma channel 3 Input gamma channel 2 Input gamma channel 1 Output gamma channel 7 Output gamma channel 8 Output gamma channel 9 Output gamma channel 10 Input gamma channel 10 Input gamma channel 9 Input gamma channel 8 Input gamma channel 7 PIN FUNCTION
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FN7430.1 May 13, 2005
EL5129, EL5329 Block Diagram
VS+
EL5129
COLUMN DRIVER
VCOM
Typical Performance Curves
5 VS=7.5V CL=10pF RL=10k GAIN (dB) 2 10 VS=7.5V RL=10k CL=100pF CL=47pF
3 GAIN (dB) RL=1k
6
1
-1
RL=562 RL=150
-2
CL=12pF
-3
-6
-5 100
1K
10K
100K
1M
10M
100M
-10 1K
10K
100K
1M
10M
100M
1G
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 1. FREQUENCY RESPONSE FOR VARIOUS RLOAD (BUFFER)
FIGURE 2. FREQUENCY RESPONSE FOR VARIOUS CLOAD (BUFFER)
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FN7430.1 May 13, 2005
EL5129, EL5329 Typical Performance Curves
VS=7.5V RL=10k CL=8pF
(Continued)
VIN
VS=7.5V RL=10k CL=8pF
VIN
2V/DIV
50mV/DIV
VOUT
VOUT
1s/DIV
100ns/DIV
FIGURE 3. LARGE SIGNAL TRANSIENT RESPONSE (BUFFER)
FIGURE 4. SMALL SIGNAL TRANSIENT RESPONSE (BUFFER)
20
VS=7.5V VOLTAGE NOISE (nV/Hz)
VS=7.5V RL=1k 0 CL=1.5pF
PSRR (dB)
100
-20 PSRR+ -40 PSRR-
10
-60
10K
100K
1M FREQUENCY (Hz)
10M
100M
-80 1K
10K
100K FREQUENCY (Hz)
1M
10M
FIGURE 5. INPUT NOISE SPECIAL DENSITY vs FREQUENCY (BUFFER)
60 VOLTAGE NOISE (nV/Hz)
FIGURE 6. PSRR vs FREQUENCY (BUFFER)
VS=7.5V RL=10k 50 VOPP=1V 40 GAIN (dB)
5
VS=7.5V CL=10pF RL=10k
3 RL=1k
1
30 20 10 0
-1
RL=562
-3
RL=150
0
500
1K CLOAD (pF)
1.5K
2K
-5 100
1K
10K
100K
1M
10M
100M
FREQUENCY (Hz)
FIGURE 7. OVERSHOOT vs CAPACITANCE LOAD (BUFFER)
FIGURE 8. FREQUENCY RESPONSE FOR VARIOUS RLOAD (VCOM)
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FN7430.1 May 13, 2005
EL5129, EL5329 Typical Performance Curves
10 VS=7.5V RL=10k
(Continued)
10
6 GAIN (dB) CL=47pF
CL=100pF
VS=7.5V RL=1k CL=47pF
6 GAIN (dB) CL=100pF
2
2
-2
CL=12pF
-2
CL=12pF
-6
-6
-10 1K
10K
100K
1M
10M
100M
1G
-10 1K
10K
100K
1M
10M
100M
1G
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 9. FREQUENCY RESPONSE FOR VARIOUS CLOAD (VCOM)
FIGURE 10. FREQUENCY RESPONSE FOR VARIOUS CLOAD (VCOM)
VS=7.5V RL=10k CL=8pF
VIN
VS=7.5V RL=10k CL=8pF
VIN
2V/DIV
50mV/DIV
VOUT
VOUT
1s/DIV
100ns/DIV
FIGURE 11. LARGE SIGNAL TRANSIENT RESPONSE (VCOM)
-20
FIGURE 12. SMALL SIGNAL TRANSIENT RESPONSE (VCOM)
VOLTAGE NOISE (nV/Hz)
VS=7.5V RL=1k 0 CL=1.5pF
VS=7.5V
PSRR (dB)
-20 PSRR+ -40 PSRR-60
100
10
-80 1K
10K
100K FREQUENCY (Hz)
1M
10M
10K
100K
1M FREQUENCY (Hz)
10M
100M
FIGURE 13. PSRR vs FREQUENCY (VCOM)
FIGURE 14. INPUT NOISE SPECIAL DENSITY vs FREQUENCY (VCOM)
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FN7430.1 May 13, 2005
EL5129, EL5329 Typical Performance Curves
50 VS=7.5V RL=10k 40 VOPP=1V OVERSHOOT (%)
(Continued)
1K OUTPUT IMPEDANCE () VS=5V
100
30
10 BUFFER 1 VCOM
20
10
0
0
200
400 CLOAD (pF)
600
800
0 1K
10K
100K FREQUENCY (Hz)
1M
10M
FIGURE 15. OVERSHOOT vs CAPACITANCE LOAD (VCOM)
800
FIGURE 16. OUTPUT IMPEDANCE vs FREQUENCY
0
VS=7.5V RL=10k 700 CL=8pF SETTLING TIME (ns) 600 500 400 300 200 BUFFER VCOM THD (dB)
VS=5V -10 AV=+1 RL=1k -20 FREQ=200kHz -30 -40 -50 -60 -70 VCOM BUFFER
2
3
4 STEP SIZE (+V)
5
6
-80
1
2
3
4
5
6
7
8
9
10
VOPP (V)
FIGURE 17. SETTLING TIME vs STEP SIZE
FIGURE 18. TOTAL HARMONIC DISTORTION vs OUTPUT VOLTAGE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - HTSSOP EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 3.5 POWER DISSIPATION (W) 3 3.333W HTSSOP28 JA=30C/W HTSSOP20 JA=35C/W TSSOP28 JA=75C/W TSSOP20 JA=90C/W 50 75 85 100 125 150
1 0.9 POWER DISSIPATION (W) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 909mW 800mW 714mW 833mW HTSSOP28 JA=110C/W TSSOP28 JA=120C/W HTSSOP20 TSSOP20 JA=140C/W JA=125C/W
2.5 2.857W 2 1.5 1.333W 1 1.111W 0.5 0 0 25
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (C)
AMBIENT TEMPERATURE (C)
FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
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FN7430.1 May 13, 2005
EL5129, EL5329 Description of Operation and Application Information
Product Description
The EL5129 and EL5329 are fabricated using a high voltage CMOS process. They exhibit rail to rail input and output capability and have very low power consumption. When driving a load of 10K and 12pF, the buffers have a -3dB bandwidth of 10MHz and exhibit 9V/s slew rate. The VCOM amplifier has a -3dB bandwidth of 12MHz and exhibit 10V/s slew rate. maximum junction temperature for the application to determine if load conditions need to be modified for the buffer to remain in the safe operating area. The maximum power dissipation allowed in a package is determined according to:
T JMAX - T AMAX P DMAX = ------------------------------------------- JA
where: * TJMAX = Maximum junction temperature * TAMAX = Maximum ambient temperature * JA = Thermal resistance of the package * PDMAX = Maximum power dissipation in the package The maximum power dissipation actually produced by an IC is the total quiescent supply current times the total power supply voltage, plus the power in the IC due to the loads, or:
P DMAX = V S x I S + i x [ ( V S + - V OUT i ) x I LOAD i ] + ( V S + - V OUT ) x I LA
Input, Output, and Supply Voltage Range
The EL5129 and EL5329 are specified with a single nominal supply voltage from 5V to 15V or a split supply with its total range from 5V to 15V. Correct operation is guaranteed for a supply range from 4.5V to 16.5V. The input common-mode voltage range of the EL5129 and EL5329 within 500mV beyond the supply rails. The output swings of the buffers and VCOM amplifier typically extend to within 100mV of the positive and negative supply rails with load currents of 5mA. Decreasing load currents will extend the output voltage even closer to each supply rails.
Output Phase Reversal
The EL5129 and EL5329 are immune to phase reversal as long as the input voltage is limited from VS- -0.5V to VS+ +0.5V. Although the device's output will not change phase, the input's over-voltage should be avoided. If an input voltage exceeds supply voltage by more than 0.6V, electrostatic protection diode placed in the input stage of the device begin to conduct and over-voltage damage could occur.
when sourcing, and:
P DMAX = V S x I S + i x [ ( V OUT i - V S - ) x I LOAD i ] + ( V OUT - V S - ) x I LA
when sinking. where: * i = 1 to total number of buffers * VS = Total supply voltage of buffer and VCOM * ISMAX = Total quiescent current * VOUTi = Maximum output voltage of the application * VOUT = Maximum output voltage of VCOM * ILOADi = Load current of buffer * ILA = Load current of VCOM If we set the two PDMAX equations equal to each other, we can solve for the RLOAD's to avoid device overheat. The package power dissipation curves provide a convenient way to see if the device will overheat. The maximum safe power dissipation can be found graphically, based on the package type and the ambient temperature. By using the previous equation, it is a simple matter to see if PDMAX exceeds the device's power derating curves.
Output Drive Capability
The EL5129 and EL5329 do not have internal short-circuit protection circuitry. The buffers will limit the short circuit current to 120mA and the VCOM amplifier will limit the short circuit current to 170mA if the outputs are directly shorted to the positive or the negative supply. If the output is shorted indefinitely, the power dissipation could easily increase such that the part will be destroyed. Maximum reliability is maintained if the output continuous current never exceeds 15mA for the buffers and 100mA for the VCOM amplifier. These limits are set by the design of the internal metal interconnections.
The Unused Buffers
It is recommended that any unused buffers should have their inputs tied to ground plane.
Power Dissipation
With the high-output drive capability of the EL5129 and EL5329, it is possible to exceed the 125C "absolutemaximum junction temperature" under certain load current conditions. Therefore, it is important to calculate the
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FN7430.1 May 13, 2005
EL5129, EL5329
Power Supply Bypassing and Printed Circuit Board Layout
As with any high frequency device, good printed circuit board layout is necessary for optimum performance. Ground plane construction is highly recommended, lead lengths should be as short as possible, and the power supply pins must be well bypassed to reduce the risk of oscillation. For normal single supply operation, where the VS- pin is connected to ground, one 0.1F ceramic capacitor should be placed from the VS+ pin to ground. A 4.7F tantalum capacitor should then be connected from the VS+ pin to ground. One 4.7F capacitor may be used for multiple devices. This same capacitor combination should be placed at each supply pin to ground if split supplies are to be used. Important Note: The metal plane used for heat sinking of the device is electrically connected to the negative supply potential (VS-). If VS- is tied to ground, the thermal pad can be connected to ground. Otherwise, the thermal pad must be isolated from any other power planes.
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FN7430.1 May 13, 2005
EL5129, EL5329 TSSOP Package Outline Drawing
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FN7430.1 May 13, 2005
EL5129, EL5329 HTSSOP Package Outline Drawing
NOTE: The package drawing shown here may not be the latest version. To check the latest revision, please refer to the Intersil website at
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 13
FN7430.1 May 13, 2005

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